The TH5000 series one - component epoxy resin structural adhesive is one of the many structural adhesive products of our company. It has the characteristic of rapid curing at 70 °C and is particularly suitable for low - temperature curing and bonding of heat - sensitive components. It is commonly used in professional fields such as CCD/CMOS modules, fingerprint identification modules, image sensors, MMC, and BGA encapsulation.

1.It can be rapidly cured at 70 °C and has good adhesion to both metals and non - metals.

2.It is environmentally friendly and meets various environmental protection requirements:

① All products of this series can pass REACH and ROHS certifications.

②)This product does not contain volatile organic solvents and complies with the latest VOC standards (GB 33372 - 2020).

1. Pre-cure Properties

2. Post-cure Properties

1、 The product must equilibrate to ambient temperature before use. Unused adhesive must be resealed and returned to cryogenic storage immediately. Each package may undergo 1-2 thawing cycles, though multiple cycles are not recommended.

2、 Product removed from packaging may become contaminated during use. To prevent contamination of unused material, never return adhesive to the original container. We assume no liability for material compromised by contamination or improper storage as described above.

3、 Prolonged exposure may cause mild dermal sensitization (itching/pain) in rare individuals. Wear chemical-resistant gloves during handling. Skin contact requires immediate removal with acetone/ethanol followed by thorough water rinsing.

4、 Data presented were obtained under laboratory conditions by our technical personnel. While providing reference value, actual performance varies with application methods and field conditions. Users must determine optimal dispensing parameters through empirical verification. For technical inquiries, contact our engineering department.