TH3000 series thermosetting one-component epoxy resin adhesive is one of our many structural adhesive products. This product has a very small coefficient of thermal expansion after curing, excellent electrical insulation, especially suitable for automotive and semiconductor control module chip large area CSP (FBGA) and BGA corner filling reinforcement, auxiliary fixed to enhance the vibration impact resistance of components.

1. fast curing speed, excellent electrical insulation.

2. Excellent resistance to mechanical stress, minimal thermal expansion

3. Environmentally friendly, in line with various environmental requirements:

① All products of this series can pass REACH, ROHS certification;

②This product does not contain volatile organic solvents, in line with the latest VOC standards: (GB 33372-2020).

1. Pre-cure Properties:

2. Post-cure Properties:

1. The product must equilibrate to ambient temperature before use. Unused adhesive must be resealed and returned to cryogenic storage immediately. Each package may undergo 1-2 thawing cycles, though multiple cycles are not recommended.
2. Product removed from packaging may become contaminated during use. To prevent contamination of unused material, never return adhesive to the original container. We assume no liability for material compromised by contamination or improper storage as described above.
3. Prolonged exposure may cause mild dermal sensitization (itching/pain) in rare individuals. Wear chemical-resistant gloves during handling. Skin contact requires immediate removal with acetone/ethanol followed by thorough water rinsing.
4. Data presented were obtained under laboratory conditions by our technical personnel. While providing reference value, actual performance varies with application methods and field conditions. Users must determine optimal dispensing parameters through empirical verification. For technical inquiries, contact our engineering department.